Description

Mobile phone composite soaking plate

Fast cooling and even heat dissipation

Semiconductor design + large area heat sink

For the hot spots of mobile phones, a large area soaking plate is used

Quickly neutralize heat to achieve even heat dissipation

strong paste

Strong adhesive, firm adsorption, not afraid of the radiator falling

Does not hurt the phone

Comes with silicone protection

Easy to take and stick, comes with silicone protection

Soft does not hurt the machine, does not scratch the hand.

For use with magnetic heatsinks

Fits the phone, seamless cooling

Product Size

60*106*1mm